![]() ![]() ![]() ![]() Yield engineers regularly identify critical areas on chips that require targeted inspection. That requires robust, high-throughput inspection strategies to detect and remedy common problems, such as missing vias. Getting a handle on EUV stochastic defects - non-repeating patterning defects such as microbridges, broken lines, or missing contacts - is at the heart of this challenge. But to meet such aggressive targets, engineers must identify defects and ramp yield faster than before. Leading chipmakers TSMC and Samsung are producing 5nm devices in high volume production and TSMC is forging ahead with plans for first 3nm silicon by year end. ![]()
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